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Physical Vapor Deposition (PVD) encompasses a range of technologies used to produce coatings ranging from nanometers to micrometers.
Conventional PVD methods typically involve a trade-off:
magnetron sputtering sacrifices quality for throughput,
while semiconductor-grade high vacuum ion beam sputtering (IBS) sacrifices throughput for quality.
At HallTech, we significantly enhance the throughput of high vacuum ion beam sputtering, achieving cost and energy efficiency without compromising on quality.
Key Parameters
High density and/or crystallinity coating
Our technology allows for production of high density or crystallinity coating on:
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cold substrate
there is no need for high temperature substrate to compact the coating
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insulating or thick substrate
there is no need for external bias or plasma sheath bias to accelerate ions and compact the coating
Energy efficient
Our technology​ maximizes sputtering yield, resulting in
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10x lower energy consumption
per kg of material sputtered, compared to magnetron*
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Maximized target material utilization
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Cost effective
Our technology allows to maximize the ionization of the working gas, resulting in:
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>>10x lower Ar consumption
per kg of material moved, compared to magnetron*
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*normalised for the same productivity
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